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SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
:
Available format(s): Hardcopy
Superseded date: 01-05-1999
Language(s): English
Published date:
Publisher: Institute of Printed Circuits
Describes various conductive and dielectric materials for use in fabricating HDI and microvias. Defines qualification and conformance requirements for materials such as photoimageable dielectric dry films and liquids, epoxy blends and coated foils.
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