• IPC 4104 : 1999

    Current The latest, up-to-date edition.

    SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS

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    Published date:  23-11-2012

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 General
      1.2 Designation System
      1.3 Application Levels
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 American Society for Testing and Materials
           (ASTM)
      2.3 Underwriters Laboratories (UL)
      2.4 American National Standards Institute (ANSI)
    3 REQUIREMENTS
      3.1 Terms and Definitions
      3.2 Specification Sheets
      3.3 Manufacturer's Quality Profile
      3.4 Qualification (Characterization) Testing
      3.5 Verification of Material Supplier's Quality
           System
      3.6 Conflict
      3.7 Materials
      3.8 General Acceptability
      3.9 Mechanical Requirements
      3.10 Chemical Requirements
      3.11 Electrical Requirements
      3.12 Environmental Requirements
      3.13 Non-Nutrient
      3.14 Workmanship
      3.15 Material Safety Data Sheets
      3.16 Shelf Life
      3.17 Marking
    4 QUALITY ASSURANCE PROVISIONS
      4.1 Quality System
      4.2 Responsibility for Inspection
      4.3 Qualification (Characterization) Testing
      4.4 Quality Conformance Inspection
      4.5 Statistical Process Control (SPC)
    5 PREPARATION FOR DELIVERY
      5.1 Packaging
    6 NOTES
      6.1 Ordering Data
      6.2 References
    APPENDIX A

    Abstract - (Show below) - (Hide below)

    Describes various conductive and dielectric materials for use in fabricating HDI and microvias. Defines qualification and conformance requirements for materials such as photoimageable dielectric dry films and liquids, epoxy blends and coated foils.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IPC JPCA 4104. (06/2002) Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC TR 483 : 1991 DIMENSIONAL STABILITY TESTING OF THIN LAMINATES - REPORT ON PHASE 1 AND PHASE 2 INTERNATIONAL ROUND ROBIN TEST PROGRAMS
    IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
    IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
    PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    BS IEC 61182-2:2006 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS
    BS EN 16602-70-12 : 2016 SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    EN 16602-70-12 : 2016 SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 2315 : 0 DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC M 107 : LATEST STANDARDS FOR PRINTED BOARD MATERIALS MANUAL
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
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