IPC MF 150 : F AMD 1
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
METAL FOIL FOR PRINTED WIRING APPLICATIONS
01-05-2000
23-11-2012
Covers unsupported electrodeposited copper foil, aluminum or copper carrier supported electrodeposited copper foil and wrought copper foil suitable for subsequent use in printed boards. The following topics are covered: functional classes; copper weight; bonding treatment. AMD 1 IS AVAILABLE FROM IPC FOR #15.13
| DevelopmentNote |
Supersedes IPC FC 150 (07/2004)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| MIL P 13949 : G (1) SUPP 1 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEGREES C) |
| I.S. EN 16602-70-11:2015 | SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| MIL-PRF-26514 Revision G:1995 | POLYURETHANE FOAM, RIGID OR FLEXIBLE, FOR PACKAGING |
| MIL-S-13949 Revision H:1993 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| EN 16602-70-11:2015 | Space product assurance - Procurement of printed circuit boards |
| BS EN 16602-70-11:2015 | Space product assurance. Procurement of printed circuit boards |
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