PRINTED BOARD QUALITY EVALUATION HANDBOOK

Available format(s)

Hardcopy

Language(s)

English

Published date

01-02-1999

Publisher

Institute of Printed Circuits

Sections
A Drilling and hole cleaning
B Plated-through hole characteristics
C Plating conditions
D Laminate imperfections
E Multilayer lamination
F Surface conductor & land conditions
G Edge contacts
H Solderability
J Solder mask
K Miscellaneous

Contains photographic illustrations of various anomalies and characteristics of printed wiring boards that can be used to identify those anomalies that are sometimes seen during inspection and evaluation processes.

DocumentType	Standard
Pages	388
PublisherName	Institute of Printed Circuits
Status	Current

IPC OI 645 : 0

STANDARD FOR VISUAL OPTICAL INSPECTION AIDS

IPC A 600 : H	ACCEPTABILITY OF PRINTED BOARDS
IPC MS 810 : 0	GUIDELINES FOR HIGH VOLUME MICROSECTION
IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS

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IPC QE 605 : A

PRINTED BOARD QUALITY EVALUATION HANDBOOK

Table of Contents

Abstract

General Product Information

Standards Referenced By This Book

Standards Referencing This Book

Category

Subcategory