IPC QE 605 : A
Current
The latest, up-to-date edition.
PRINTED BOARD QUALITY EVALUATION HANDBOOK
Hardcopy
English
01-02-1999
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Sections
A Drilling and hole cleaning
B Plated-through hole characteristics
C Plating conditions
D Laminate imperfections
E Multilayer lamination
F Surface conductor & land conditions
G Edge contacts
H Solderability
J Solder mask
K Miscellaneous
Contains photographic illustrations of various anomalies and characteristics of printed wiring boards that can be used to identify those anomalies that are sometimes seen during inspection and evaluation processes.
| DocumentType |
Standard
|
| Pages |
388
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC MS 810 : 0 | GUIDELINES FOR HIGH VOLUME MICROSECTION |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
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