IPC A 600 : H
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
ACCEPTABILITY OF PRINTED BOARDS
Available format(s)
Hardcopy , PDF
Language(s)
English, Japanese, German, Swedish
Published date
13-04-2010
Publisher
Superseded date
13-04-2010
Excluding VAT
Acknowledgment
1 Introduction
2 Externally Observable Characteristics
3 Internally Observable Characteristics
4 Miscellaneous
5 Cleanliness Testing
Specifies the target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards.
| DevelopmentNote |
Included in IPC C 102, IPC C 105 & IPC C 1000. H2010 Edition is still available in Swedish, Polish, Russian languages, See separate records. G2004 Edition is still available in ITALIAN language, See separate record. Also available in French, Chinese, German & Spanish languages, See separate records. (02/2017) Also available in Japanese language, See IPC A 600 JAPANESE. (08/2017) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
157
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| Supersedes |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| BS EN 50155:2017 | Railway applications. Rolling stock. Electronic equipment |
| BS EN 60079-18 : 2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| 16/30282633 DC : 0 | BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| IPC 2224 : 0 | SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| IPC 2225 : 0 | SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| MIL-PRF-31032-2 Revision C:2017 | Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or Without Plated-Through Holes, for Soldered Part Mounting |
| MIL-PRF-31032-1 Revision D:2017 | Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or Without Blind and Buried Plated-Through Holes, for Soldered Part Mounting |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| MIL-P-46843 Revision C:1989 | PRINTED WIRING ASSEMBLIES, PRODUCTION OF (NO S/S DOCUMENT) |
| MIL-PRF-31032-4 Revision C:2017 | Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting |
| MIL-PRF-31032-6 Revision B:2017 | Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| MIL-PRF-31032-3 Revision C:2017 | Printed Wiring Board, Flexible, Single and Double Layer, with or Without Plated-Through Holes, with or Without Stiffeners, for Soldered Part Mounting |
| MIL-PRF-31032-5 Revision B:2017 | Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications |
| SAE AS7119B | Nadcap Aerospace Standard for Electronics Printed Circuit Boards |
| DD IEC PAS 62050 : DRAFT 2004 | BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
| I.S. EN 50155:2017-11 | RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
| IEC 60079-18:2014 RLV | Explosive atmospheres - Part 18: Equipment protection by encapsulation “m” |
| EN 50155:2017 | Railway applications - Rolling stock - Electronic equipment |
| IEC PAS 62050:2004 | Board level drop test method of components for handheld electronic products |
| BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
| BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| 13/30271432 DC : 0 | BS EN 60079-18 ED 4.0 - EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| EN 60079-18:2015/A1:2017 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' (IEC 60079-18:2014/A1:2017) |
| I.S. EN 60079-18:2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| NBR IEC 60079-18 : 2016 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
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