• IPC QE 605 : A

    Current The latest, up-to-date edition.

    PRINTED BOARD QUALITY EVALUATION HANDBOOK

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    Language(s): 

    Published date:  01-02-1999

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    Sections
    A Drilling and hole cleaning
    B Plated-through hole characteristics
    C Plating conditions
    D Laminate imperfections
    E Multilayer lamination
    F Surface conductor & land conditions
    G Edge contacts
    H Solderability
    J Solder mask
    K Miscellaneous

    Abstract - (Show below) - (Hide below)

    Contains photographic illustrations of various anomalies and characteristics of printed wiring boards that can be used to identify those anomalies that are sometimes seen during inspection and evaluation processes.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
    IPC MS 810 : 0 GUIDELINES FOR HIGH VOLUME MICROSECTION
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
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