IPC S 804 : A1987

Provides a recommended test method which may be used by both vendor and user to determine solderability of printed wiring boards, with or without surface coatings, which will be soldered. The solderability determination is made to verify that the printed wiring fabrication processes and storage have had no adverse effect on the solderability of the printed wiring board. This is determined by evaluating the ability of those portions of the printed wiring board normally soldered to be wetted by the new cast of solder. Determination is judged by nondestructive methods.