IPC SMC WP 001 : 1991
Current
Current
The latest, up-to-date edition.
SOLDERING CAPABILITY WHITE PAPER REPORT
Published date
01-08-1991
Publisher
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Describes design for soldering processes in the electronic packaging industry, including solderable components and soldering process.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC TR 001 : 1989 | AN INTRODUCTION TO TAPE AUTOMATED BONDING FINE PITCH TECHNOLOGY |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
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