IPC SMC WP 003 : 1993
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
CHIP MOUNTING TECHNOLOGY (CMT)
04-10-2023
01-08-1993
Discusses technology status on various methods for mounting and interconnecting active devices to various substrate materials. Reviews current mounting techniques of tape automated bonding (TAB) chip on board (COB) and flip chip. Also covers examinations of the most frequently used substrate options of laminate, ceramic and silicon.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| Supersedes |
| IPC TR 001 : 1989 | AN INTRODUCTION TO TAPE AUTOMATED BONDING FINE PITCH TECHNOLOGY |
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