IPC WP 003 : 1993
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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CHIP MOUNTING TECHNOLOGY (CMT)
Published date
12-01-2013
Publisher
Superseded date
01-08-1993
Superseded by
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Summarizes status of the technology discussion on various methodologies for mounting and interconnecting active devices to a variety of substrate materials. Reviews current mounting techniques of tape automated bonding, chip on board and flip chip, together with examinations of the most commonly used substrate options of laminate, ceramic and silicon.
| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy |
| IPC J STD 013 : 0 | IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IPC J STD 026 : 0 | SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
Summarise
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