IPC TF 870 : 0
Current
Current
The latest, up-to-date edition.
QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS
Available format(s)
Hardcopy
Language(s)
English
Published date
01-11-1989
Publisher
Defines materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. Can also be used for procurement of single and double-sided boards.
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC HM 860 : 0 | SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS |
| IPC D 859 : 0 | DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS |
| IPC A 23 : LATEST | POLYMER THICK FILM ARTWORK |
| IPC M 102 : LATEST | FLEXIBLE CIRCUITS COMPENDIUM |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC M 105 : LATEST | RIGID PRINTED BOARD MANUAL |
| IPC HM 860 : 0 | SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS |
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