IPC HM 860 : 0
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
Available format(s)
PDF
Language(s)
English
Published date
01-01-1987
Publisher
Excluding VAT
Covers the qualification & performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of 3 or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may include passive elements.
| DocumentType |
Standard
|
| Pages |
35
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES (NO S/S DOCUMENT) |
| IPC D 859 : 0 | DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS |
| IPC TF 870 : 0 | QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS |
| IPC TF 870 : 0 | QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
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