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  • IPC TF 870 : 0

    Current The latest, up-to-date edition.

    QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-11-1989

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Defines materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. Can also be used for procurement of single and double-sided boards.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC HM 860 : 0 SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
    IPC D 859 : 0 DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS
    IPC A 23 : LATEST POLYMER THICK FILM ARTWORK

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC M 102 : LATEST FLEXIBLE CIRCUITS COMPENDIUM
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
    IPC HM 860 : 0 SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
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