IPC TR 464 : 0
Current
Current
The latest, up-to-date edition.
ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS
Available format(s)
Hardcopy
Language(s)
English
Published date
01-04-1984
Publisher
Developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage.
| DevelopmentNote |
Also available in CD-ROM format. (09/2005) A1987 incorporates addendum. (04/2014)
|
| DocumentType |
Technical Report
|
| Pages |
138
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC TR 461 : 1979 | SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS |
| IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
| IPC TR 462 : 0 | SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE |
| IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
| IPC TR 465 2 : 1993 | THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS |
| IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
| IPC TR 465 3 : - | EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A |
| IPC TR 462 : 0 | SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE |
| IPC TR 461 : 1979 | SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS |
| IPC TR 465 2 : 1993 | THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
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