IPC TR 465 2 : 1993
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
14-09-2023
23-11-2012
Details the results of a two-year study to determine the effect of steam aging exposure on components. It concludes that 98 Degree C for 8 hours is the optimal condition for industry specifications for both component leads and printed boards.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| IPC TR 461 : 1979 | SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS |
| IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
| IPC TR 462 : 0 | SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE |
| IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
| IPC TR 464 : 0 | ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS |
| IPC TR 464 : 0 | ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS |
| IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
| IPC TR 465 3 : - | EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A |
| IPC TR 462 : 0 | SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.