• IPC TR 484 : 1986

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY

    Available format(s): 

    Withdrawn date:  13-09-2023

    Language(s): 

    Published date:  23-11-2012

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 Introduction
    1.1 Objectives and scope
    1.2 Background
    2.0 Round robin test program
    3.0 Round robin results - phase I
    3.1 Thickness measurements
    3.2 Test mandrel selection
    3.3 Tensile properties
    3.4 Grain structure
    4.0 Recommendations - phase I
    5.0 Copper foil fatigue behavior and cyclic life
         predictions
    6.0 Round robing results - phase II
    6.1 Standard electrodeposited copper foil, CF-E1
    6.2 High-ductility electrodeposited copper foil, CF-E2
    6.3 High temperature ductility electrodeposited copper
         foil CF-E3
    6.4 Annealed electrodeposited copper foil, CF-E4
    6.5 As-rolled wrought copper foil, CF-W5
    6.6 Annealed wrought copper foil, CF-W7
    6.7 Low temperature annealable wrought copper foil,
         CF-W8
    6.8 Ductility results from 40-mil diameter test
         mandrels
    7.0 Miscellaneous observations
    8.0 Summary, conclusions and recommendations
    8.1 Conclusions
    8.2 Recommendations
    References
    Appendices
    A IPC test plan for copper foil ductility round robin
    B IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
         Fatigue and Ductility, Foil", August 1980
    C Operating instructions for fatigue ductility flex
         tester
    D Data sheet sample
    E IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
         Fatigue and Ductility, Foil," Revision A, December
         1983
    Figures
    1 Means, standard deviations and ranges of measured
         gauge thicknesses of wrought and electrodeposited
         copper foil samples normalized relative to means
         from test lab A
    2 Means, standard deviations and ranges of measured
         gauge and core thicknesses of electrodeposited
         copper foil samples normalized relative to means
         from test lab A
    3 Photomicrographic cross-section of 2 oz./ft2
         electrodeposited copper foil sample
    4 Means of measured gauge and plating tooth/adhesion
         treatment thicknesses differentiated by foil weight
         and vendor
    5 Manson-Coffin plot (cyclic strain range vs. fatigue
         life) showing contributions of elastic and plastic
         strains and deviation at extremely low-cycle
         fatigue
    6 Manson-Coffin plot of a CF-E3-2-S(XM) copper foil
         sample showing fatigue data ranging from 4.0 to
         185,00 cycles-to-failure superimposed on fatigue
         curve predicted from tensile properties
    7 Manson-Coffin plot of predicted and experimental
         fatigue behavior of CF-E1-1-S and CF-E4-1-S copper
         foil samples
    8 Manson-Coffin plot of predicted and experimental
         fatigue behavior of CF-W5-1-S and CF-W7-1-S copper
         foil samples
    9 Manson-Coffin plot of predicted and experimental
         fatigue behavior of CF-E1-1-S and CF-W5-1-S copper
         foil samples
    10 Ductility results for standard electrodeposited
         copper foil, CF-E1, for various foil weights and
         foil vendors
    11 Ductility results for high-ductility
         electrodeposited copper foil, CF-E2, for various
         foil weights and foil vendors
    12 Ductility results for high temperature ductility
         electrodeposited copper foil, CF-E3, for various
         foil weights and foil vendors
    13 Ductility results for annealed electrodeposited
         copper foil, CF-E4, for various foil weights and
         foil vendors
    14 Ductility results for as-rolled wrought copper
         foil, CF-W5, for various foil weights and foil
         vendors
    15 Ductility results for annealed wrought copper
         foil, CF-W7, for various foil weights and foil
         vendors
    16 Ductility results for low temperature annealable
         wrought copper foil, CF-W8, before and after
         annealing for various foil weights and foil vendors
    Tables
    1 Copper foil sample distribution for ductility round
         robin study
    2 Tensile strengths of the copper foil samples
         submitted for the ductility round robin study
    3 Proposed and established minimum ductility
         requirements for IPC Standard ANSI/IPC-CF-150
    4 Comparison of fatigue lives and ductility results
         from tests with 79-, 62- and 40-mil diameter
         mandrels

    Abstract - (Show below) - (Hide below)

    Determines ductility of the foils provided by the industry's copper foil vendors.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
    IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
    IPC TR 482 : 1976 NEW DEVELOPMENTS IN THIN COPPER FOILS
    IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    IPC 4562 CHINESE : A METAL FOIL FOR PRINTED BOARD APPLICATIONS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
    IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    IPC TR 482 : 1976 NEW DEVELOPMENTS IN THIN COPPER FOILS
    IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
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