IPC TR 485 : 1985

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RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY

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Withdrawn date: 13-09-2023

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Published date: 23-11-2012

Publisher: Institute of Printed Circuits

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Reports the results of a round robin study of copper foil. The usefulness of elevated temperature elongation testing for determining mechanical properties of foil came under question by the Metallic Foil Subcommittee due to problems of test result reproducibility. Therefore the alternate method of rupture testing came under consideration.

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Document Type	Standard
ISBN
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Published
Publisher	Institute of Printed Circuits
Status	Withdrawn

Standards Referenced By This Book - (Show below) - (Hide below)

IPC CF 152 : B	COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC TR 482 : 1976	NEW DEVELOPMENTS IN THIN COPPER FOILS
IPC TR 484 : 1986	RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
IPC 4562 : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC 4562 CHINESE : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS

Standards Referencing This Book - (Show below) - (Hide below)

IPC TR 484 : 1986	RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
IPC 4562 : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC TR 482 : 1976	NEW DEVELOPMENTS IN THIN COPPER FOILS
IPC CF 152 : B	COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS

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