IPC CF 152 : B
Current
The latest, up-to-date edition.
COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
Hardcopy , PDF
English
01-12-1997
1 SCOPE
1.1 Purpose
1.2 Designation
1.3 Presentation
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 American Society for Testing Materials
2.3 Military Standards
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 General Requirements - Acceptability
3.3 Visual
3.4 Dimensional
3.5 Physical Requirements
3.6 Processing Requirements - Treated Composite Foils
4 QUALITY ASSURANCE PROVISIONS
4.1 Quality Conformance Evaluations
4.2 Classification of Inspections
4.3 Qualification Inspection
4.4 Quality Conformance Inspection
4.5 Test Methods
4.6 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
5.1 Shipping Requirements
5.2 Documentation
5.3 Marking
6 NOTES
6.1 Ordering Data
6.2 References
APPENDIX 1
1 Overlay Volume Ratio
1.A A Chemical Etch Method to Determine Copper Invar
Copper Foil Ratio
1.B Overlay Thickness Ratio for Copper/Invar/Copper
Metal Core
2 Determination of Coefficient of Thermal Expansion
(CTE) Method
2.B Fixturing of Thin Strip/Foil Materials for CTE
Measurements
Figures
Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composite.
| DevelopmentNote |
Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
| IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
| IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
| IPC 4101 CHINESE : C2009 | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 4101 GERMAN : C | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| I.S. EN 16602-70-11:2015 | SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| EN 16602-70-11:2015 | Space product assurance - Procurement of printed circuit boards |
| IPC MC 324 : 1988 | PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS |
| BS EN 16602-70-11:2015 | Space product assurance. Procurement of printed circuit boards |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| I.S. EN 16602-70-12:2016 | SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS |
| IPC CF 148 : A1998 | RESIN COATED METAL FOR PRINTED BOARDS |
| IPC L 125 : A | Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
| IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
| IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |