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  • IPC WP 009 : 0

    Current The latest, up-to-date edition.

    A SUMMARY OF TIN WHISKER RESEARCH REFERENCES

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    Published date:  14-05-2009

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    List of Figures
    Summary Bibliography of Papers
    Overview of Papers
    Conclusions

    Abstract - (Show below) - (Hide below)

    Specifies the concern over tin whiskers as a reliability hazard that has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
    IPC JP002 : 0 JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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