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IPC HDBK 830 : A

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS

Published date

07-10-2013

1 PREFACE
2 APPLICABLE DOCUMENTS
3 ENVIRONMENTAL, HEALTH AND SAFETY
   (EHS) REQUIREMENTS
4 CONFORMAL COATING MATERIALS
5 DESIGN FOR COATING APPLICATION
6 RAW MATERIALS CHARACTERISTICS
7 COMPATIBILITY
8 PROCESSING
9 FILM PROPERTIES
10 REWORK, REPAIR AND RESTORATION
11 END USE ENVIRONMENT
12 LONG TERM RELIABILITY AND TESTING
13 BIBLIOGRAPHY
APPENDIX A - Conformal Coating Comparison
             Guide
APPENDIX B - Flow Cup Viscosity
             Measurement
APPENDIX C - Troubleshooting GuidE
APPENDIX D - Thermal Analysis
APPENDIX E - Relative Humidity
APPENDIX F - Time of Wetness
APPENDIX G - Atmospheric Particulates
APPENDIX H - Airborne ContaminantS
APPENDIX I - Simulated Acid Rain Test
APPENDIX J - Coating for Medical Applications
APPENDIX K - Example of Stringent Test for Any
             Breach in A Conformal Coating
APPENDIX L - TIN WHISKERS
APPENDIX M - FUNGUS TEST METHOD
APPENDIX N - HMIS CONTAINER LABELING
             SYSTEM
APPENDIX O - GHS HAZARD SYMBOLS AND
             CLASSES
APPENDIX P - GHS SAFETY DATA SHEETS
             (SDSS) CONTENTS
APPENDIX Q - NPL REPORT
APPENDIX 1 - GC-MS Flux Analysis

Describes as a thin, transparent, polymeric coating that is applied to the surfaces of PCAs to provide protection from the end-use environment.

Committee
5-30
DevelopmentNote
Included in IPC C 1000. (07/2008) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC CC0201-CD : 2010 CONFORMAL COATING APPLICATIONS, INSPECTION, REWORK & QUALITY CONTROL INTERACTIVE CD-ROM
IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC CC0509 : 2009 CONFORMAL COATING PHOTO GUIDE ON CD
IPC 5702 : 0 GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS
IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC HDBK 850 : 0 GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC P-CC0509 : 2009 CONFORMAL COATING PHOTOGRAPHIC POSTER GUIDE
IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IPC WP 009 : 0 A SUMMARY OF TIN WHISKER RESEARCH REFERENCES
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
SEMI S2 : 2016B ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
ASTM G 21 : 2015 : REDLINE Standard Practice for Determining Resistance of Synthetic Polymeric Materials to Fungi
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
EN ISO 2360:2017 Non-conductive coatings on non-magnetic electrically conductive base metals - Measurement of coating thickness - Amplitude-sensitive eddy-current method (ISO 2360:2017)
MIL-STD-810 Revision G:2008 ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
NFPA 79 : 2015 ELECTRICAL STANDARD FOR INDUSTRIAL MACHINERY
IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
MIL-I-46058 Revision C:1972 Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
ASTM E 595 : 2015 : REDLINE Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC HDBK 850 : 0 GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
NFPA 496 : 2017 PURGED AND PRESSURIZED ENCLOSURES FOR ELECTRICAL EQUIPMENT
ASTM F 22 : 2013 : REDLINE Standard Test Method for Hydrophobic Surface Films by the Water-Break Test
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
MIL-HDBK-454 Revision B:2007 GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT
IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
NFPA 33 : 2016 SPRAY APPLICATION USING FLAMMABLE OR COMBUSTIBLE MATERIALS
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
NFPA 35 : 2016 MANUFACTURE OF ORGANIC COATINGS
ASTM G 154 : 2016 : REDLINE Standard Practice for Operating Fluorescent Ultraviolet (UV) Lamp Apparatus for Exposure of Nonmetallic Materials
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
MIL-F-13927 Revision A:1957 FUNGUS RESISTANCE TEST, AUTOMOTIVE COMPONENTS
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
ASTM G 155 : 2013 : REDLINE Standard Practice for Operating Xenon Arc Light Apparatus for Exposure of Non-Metallic Materials
IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC 1331 : 0 VOLUNTARY SAFETY STANDARD FOR ELECTRICALLY HEATED PROCESS EQUIPMENT
MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
1998/37/EC : 1998 DIRECTIVE 98/37/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL OF 22 JUNE 1998 ON THE APPROXIMATION OF THE LAWS OF THE MEMBER STATES RELATING TO MACHINERY
ASTM D 1212 : 1991 Standard Test Methods for Measurement of Wet Film Thickness of Organic Coatings
ANSI B11.1 : 2009 SAFETY REQUIREMENTS FOR MECHANICAL POWER PRESSES
ASTM D 570 : 1998 : R2018 Standard Test Method for Water Absorption of Plastics
SEMI S14 : 2016 SAFETY GUIDELINES FOR FIRE RISK ASSESSMENT AND MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
ASTM D 3359 : 2017 : REDLINE Standard Test Methods for Rating Adhesion by Tape Test
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
ASTM F 1249 : 2013 : REDLINE Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
EN ISO 2808:2007 Paints and varnishes - Determination of film thickness (ISO 2808:2007)
EN 60204-1 : 2006 COR 2010 SAFETY OF MACHINERY - ELECTRICAL EQUIPMENT OF MACHINES - PART 1: GENERAL REQUIREMENTS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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