IPC HDBK 830 : A
Current
The latest, up-to-date edition.
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
English
01-08-2013
1 PREFACE
2 APPLICABLE DOCUMENTS
3 ENVIRONMENTAL, HEALTH AND SAFETY
(EHS) REQUIREMENTS
4 CONFORMAL COATING MATERIALS
5 DESIGN FOR COATING APPLICATION
6 RAW MATERIALS CHARACTERISTICS
7 COMPATIBILITY
8 PROCESSING
9 FILM PROPERTIES
10 REWORK, REPAIR AND RESTORATION
11 END USE ENVIRONMENT
12 LONG TERM RELIABILITY AND TESTING
13 BIBLIOGRAPHY
APPENDIX A - Conformal Coating Comparison
Guide
APPENDIX B - Flow Cup Viscosity
Measurement
APPENDIX C - Troubleshooting GuidE
APPENDIX D - Thermal Analysis
APPENDIX E - Relative Humidity
APPENDIX F - Time of Wetness
APPENDIX G - Atmospheric Particulates
APPENDIX H - Airborne ContaminantS
APPENDIX I - Simulated Acid Rain Test
APPENDIX J - Coating for Medical Applications
APPENDIX K - Example of Stringent Test for Any
Breach in A Conformal Coating
APPENDIX L - TIN WHISKERS
APPENDIX M - FUNGUS TEST METHOD
APPENDIX N - HMIS CONTAINER LABELING
SYSTEM
APPENDIX O - GHS HAZARD SYMBOLS AND
CLASSES
APPENDIX P - GHS SAFETY DATA SHEETS
(SDSS) CONTENTS
APPENDIX Q - NPL REPORT
APPENDIX 1 - GC-MS Flux Analysis
Describes as a thin, transparent, polymeric coating that is applied to the surfaces of PCAs to provide protection from the end-use environment.
| Committee |
5-30
|
| DevelopmentNote |
Included in IPC C 1000. (07/2008) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61183-109-9
|
| Pages |
183
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC CC0201-CD : 2010 | CONFORMAL COATING APPLICATIONS, INSPECTION, REWORK & QUALITY CONTROL INTERACTIVE CD-ROM |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC CC0509 : 2009 | CONFORMAL COATING PHOTO GUIDE ON CD |
| IPC 5702 : 0 | GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
| IPC P-CC0509 : 2009 | CONFORMAL COATING PHOTOGRAPHIC POSTER GUIDE |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IPC WP 009 : 0 | A SUMMARY OF TIN WHISKER RESEARCH REFERENCES |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ASTM G 21 : 2015 : REDLINE | Standard Practice for Determining Resistance of Synthetic Polymeric Materials to Fungi |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| EN ISO 2360:2017 | Non-conductive coatings on non-magnetic electrically conductive base metals - Measurement of coating thickness - Amplitude-sensitive eddy-current method (ISO 2360:2017) |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| NFPA 79 : 2015 | ELECTRICAL STANDARD FOR INDUSTRIAL MACHINERY |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
| NFPA 496 : 2017 | PURGED AND PRESSURIZED ENCLOSURES FOR ELECTRICAL EQUIPMENT |
| ASTM F 22 : 2013 : REDLINE | Standard Test Method for Hydrophobic Surface Films by the Water-Break Test |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| MIL-HDBK-454 Revision B:2007 | General Guidelines for Electronic Equipment |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| NFPA 33 : 2016 | SPRAY APPLICATION USING FLAMMABLE OR COMBUSTIBLE MATERIALS |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| NFPA 35 : 2016 | MANUFACTURE OF ORGANIC COATINGS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| MIL-F-13927 Revision A:1957 | Fungus Resistance Test; Automotive Components (S/S by ASTM-G21) |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC 1331 : 0 | VOLUNTARY SAFETY STANDARD FOR ELECTRICALLY HEATED PROCESS EQUIPMENT |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| 1998/37/EC : 1998 | DIRECTIVE 98/37/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL OF 22 JUNE 1998 ON THE APPROXIMATION OF THE LAWS OF THE MEMBER STATES RELATING TO MACHINERY |
| ASTM D 1212 : 1991 | Standard Test Methods for Measurement of Wet Film Thickness of Organic Coatings |
| ANSI B11.1 : 2009 | SAFETY REQUIREMENTS FOR MECHANICAL POWER PRESSES |
| ASTM D 570 : 1998 : R2018 | Standard Test Method for Water Absorption of Plastics |
| ASTM D 3359 : 2017 : REDLINE | Standard Test Methods for Rating Adhesion by Tape Test |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| ASTM F 1249 : 2013 : REDLINE | Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor |
| EN ISO 2808:2007 | Paints and varnishes - Determination of film thickness (ISO 2808:2007) |
| EN 60204-1 : 2006 COR 2010 | SAFETY OF MACHINERY - ELECTRICAL EQUIPMENT OF MACHINES - PART 1: GENERAL REQUIREMENTS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |