ISO 9455-17:2024
Current
The latest, up-to-date edition.
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
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English, French
10-01-2024
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This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type1 and type2 fluxes, as specified in ISO9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
| Committee |
ISO/TC 44/SC 12
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| PN-EN ISO 9455-17:2024-07 | Identical |
| DS/ISO 9455-17:2024 | Identical |
| ÖNORM EN ISO 9455-17:2024 06 15 | Identical |
| NS-EN ISO 9455-17:2024 | Identical |
| DS/EN ISO 9455-17:2024 | Identical |
| UNI EN ISO 9455-17:2024 | Identical |
| PNE-EN ISO 9455-17 | Identical |
| BS EN ISO 9455-17:2024 | Identical |
| UNE-EN ISO 9455-17:2024 | Identical |
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