JEDEC JESD 22-B113A:2012
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICs FOR HANDHELD ELECTRONIC PRODUCTS
Hardcopy , PDF
20-12-2022
English
01-09-2012
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications.
DocumentType |
Test Method
|
Pages |
0
|
ProductNote |
THIS STANDARD ALSO REFERS:JEDEC 9704
|
PublisherName |
JEDEC Solid State Technology Association
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.