JEDEC JESD 51-10 : 2000
Current
Current
The latest, up-to-date edition.
Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-07-2000
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This specification covers through-hole mount perimeter leaded packages intended to be mounted on a PCB. It does not cover area array packages that require sockets or PGA packages.
| DocumentType |
Standard
|
| Pages |
18
|
| ProductNote |
This standard also refers toEIA/JESD51, EIA/JESD51-6, EIA/JESD51-2, EIA/JESD51-1
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| CEI EN IEC 60749-10:2022 | Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly |
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