JEDECJESD22-B113B : 2018
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-08-2018
Publisher
Superseded date
24-12-2025
Superseded by
Free
Excluding VAT
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of SMT ICs while duplicating the failure modes normally observed during product level test.
| DocumentType |
Test Method
|
| Pages |
26
|
| ProductNote |
this Standards also refers IPC-SMT-782 , J-STD-020, J-STD-033,IPC-9701, IPC/JEDEC-9702, IPC/JEDEC-9704,IPC/JEDEC-9706 .
JESD22-B113A and JESD22-B113 . |
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy |
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