JIS C 0099:2005
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Environmental testing: Tests - Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
Hardcopy , PDF
22-09-2014
Japanese, English
20-03-2005
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This Japanese Industrial Standard specifies the methods for testing the solderability of the metal terminal or the electrode of the surface mounting devices mounted on a printed wiring board by wetting balance using lead-free solder paste.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy |
| JIS Z 3284:1994 | Solder paste |
| JIS K 0066:1992 | Test methods for distillation of chemical products |
| JIS H 3100:2006 | Copper and copper alloy sheets, plates and strips |
| JIS C 60068-2-54:1996 | Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method |
| JIS K 0068:2001 | Test methods for water content of chemical products |
| JIS K 5902:1969 | Colophonium |
| JIS K 0114:2000 | General rules for gas chromatographic analysis |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS K 0064:1992 | Test methods for melting point and melting range of chemical products |
| JIS C 60068-2-20:1996 | Basic environmental testing procedures Part 2: Tests. Test T: Soldering |
| JIS C 5602:1986 | Glossary of passive components for electronic equipment |
| JIS K 0067:1992 | Test methods for loss and residue of chemical products |
| JIS K 0070:1992 | Test methods for acid value, saponification value, ester value, iodine value, hydroxyl value and unsaponifiable matter of chemical products |
| JIS C 60068-2-58:2006 | Environmental Testing - Part 2: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd) |
| JIS C 60068-1:1993 | Environmental testing Part 1: General and guidance |
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