JIS C 5101-1:2023
Current
Current
The latest, up-to-date edition.
Fixed capacitors for use in electronic equipment -- Part 1: Generic specification
Available format(s)
Hardcopy
Language(s)
Japanese
Published date
20-11-2023
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| DocumentType |
Revision
|
| Pages |
94
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60384-1:2021 | Identical |
| JIS C 60068-2-14:2011 | Environmental testing Part 2-14: Tests - Test N: Change of temperature |
| JIS C 60068-2-45:1995 | Environmental testing procedures of electronic and electrical resistance to solvents (immersion in cleaning solvents) |
| JIS C 60068-2-69:2019 | Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| JIS C 60068-2-27:2011 | Environmental testing -- Part 2-27: Tests -- Test Ea: Shock |
| JIS C 60068-2-30:2011 | Environmental testing -- Part 2-30: Tests -- Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
| JIS C 60068-2-6:2010 | Environmental testing Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| JIS C 60068-1:2016 | Environmental Testing - Part 1: General And Guidance |
| JIS C 60068-2-21:2023 | Environmental testing -- Part 2-21: Tests -- Test U: Robustness of terminations and integral mounting devices |
| JIS C 60068-2-2:2010 | Environmental testing -- Part 2-2 : Tests -- Test B: Dry heat Part 2-2 : Tests - Test B: Dry heat |
| JIS C 60068-2-78:2015 | Environmental Testing - Part 2-78: Tests - Test Cab: Damp Heat, Steady State |
| JIS C 60068-2-67:2001 | Environmental testing -- Part 2: Tests -- Test Cy: Damp heat, steady state, accelerated test primarily intended for components Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| JIS C 60068-2-20:2022 | Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| JIS C 60068-2-82:2021 | Environmental testing -- Part 2-82: Tests -- Test Xw1: Whisker test methods for components and parts used in electronic assemblies |
| JIS C 60068-2-13:2023 | Environmental testing -- Part 2-13: Tests -- Test M: Low air pressure |
| JIS C 60068-2-58:2016 | Environmental Testing - Part 2-58: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd) |
| JIS C 60068-2-1:2010 | Environmental testing Part 2-1: Tests - Test A: Cold |
| JIS Z 8601:1954 | Preferred numbers |
| JIS C 60068-2-17:2001 | Basic environmental testing procedures -- Part 2: Tests -- Test Q: Sealing Part 2: Tests - Test Q: Sealing |
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