JIS C 60068-2-69:2019
Current
The latest, up-to-date edition.
Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Hardcopy , PDF
Japanese - English
20-03-2019
This Standard outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards.
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