JIS C 5402-6-2:2005
Current
The latest, up-to-date edition.
Connectors for electronic equipment -- Tests and measurements Part 6-2: Dynamic stress tests - Test 6b: Bump
Hardcopy , PDF
English, Japanese
20-03-2005
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This section of JIS C 5402-6 is to define a standard test method to assess the ability of components to withstand specified severities of bump.
| DocumentType |
Test Method
|
| Pages |
3
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60512-6-2:2002 | Identical |
Reaffirmed 2014 2005(R2014) [20/10/2014]2005(R2009) [01/10/2009]2005 [20/03/2005]
| JIS C 5402-1-100:2005 | Connectors For Electronic Equipment - Tests And Measurements - Part 1-100: General - Applicable Publications |
| JIS C 5402-1-1:2005 | Connectors for electronic equipment --Tests and measurements-- Part 1-1: General examination -- Test 1a: Visual examination |
| JIS C 5402-2-1:2005 | Connectors for electronic equipment - Tests and measurements Part 2-1: Electrical continuity and contact resistance tests - Test 2a : Contact resistance - Millivolt level method |
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