JIS C 60068-2-20:1996
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Basic environmental testing procedures Part 2: Tests. Test T: Soldering Part 2: Tests. Test T: Soldering
Available format(s)
PDF
Language(s)
English
Published date
31-07-1996
Publisher
Withdrawn date
23-10-2025
Superseded by
€36.18
Excluding VAT
This Standard is applicable to all electrical and electronic components liable to be submitted to the tests described below.
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-20:1979 | Identical |
| JIS C 2570:1998 | Directly heated negative temperature coefficient thermistors |
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| JIS H 8624:1999 | Electroplated coatings of Tin-lead alloys |
| JIS C 60068-2-54:1996 | Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method |
| JIS B 7102:1995 | Small flash connections for cameras |
| JIS C 5260-1:1999 | Potentiometers for use in electronic equipment Part 1: Generic specification Part 1: Generic specification |
| JIS C 4526-2-5:2005 | Switches for appliances -- Part 2-5: Particular requirements for change-over selectors |
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| JIS C 5402:1992 | Method for test of connectors for use in electronic equipment |
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| JIS H 8645:1999 | Autocatalytic nickel-phosphorus coatings on metals |
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| JIS C 6575-3:2005 | Miniature fuses -- Part 3: Sub-miniature fuse-link Part 3: Sub-miniature fuse-link |
| JIS C 5402-12-6:2002 | Connectors for electronic equipment -- Tests and measurements -- Part 12-6: Soldering tests -- Test 12f: Sealing against flux and cleaning solvents in machine soldering |
| JIS C 6691:2003 | Thermal-links -- Requirements and application guide |
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| JIS C 8324:2004 | Lampholders for tubular fluorescent lamps and starterholders |
| JIS C 5402-12-7:2005 | Connectors for electronic equipment -- Tests and measurements -- Part 12-7: Soldering tests -- Test 12g: Solderability, wetting balance method |
| JIS C 5012:1993 | Test methods for printed wiring boards |
| JIS C 60068-1:1993 | Environmental testing Part 1: General and guidance Part 1: General and guidance |
| JIS C 5381-331:2006 | Components for low-voltage surge protective devices -- Part 331: Specification for metal oxide varistors (MOV) |
| JIS C 5944:2005 | General rules of laser diode modules for fiber optic transmission |
| JIS C 6462:1996 | Test methods of variable capacitors for use in electronic equipment |
| JIS C 5444:2000 | Testing methods of surface mounting switches for use in electronic equipment |
| JIS C 6575-2:2005 | Miniature fuses -- Part 2: Cartridge fuse-links Part 2: Cartridge fuse-links |
| JIS H 8621:1998 | Electroplated coatings of silver for engineering purposes |
| JIS C 6701:2007 | Generic specification of quartz crystal units |
| JIS C 6710:2007 | Generic specification of crystal controlled oscillators |
| JIS C 2809:1999 | Flat, quick-connect terminations |
| JIS C 60068-2-21:2002 | Environmental testing -- Part 2-21: Tests -- Test U: Robustness of termination and integral mounting devices Part 2-21: Tests - Test U: Robustness of termination and integral mounting devices |
| JIS E 6202:1993 | Electromagnetic relays for railway rolling stock -- General requirement |
| JIS C 5441:1994 | Testing methods of switches for use in electronic equipment |
| JIS C 5202:1990 | Test methods of fixed resistors for electronic equipment |
| JIS H 8620:1998 | Electroplated coatings of gold and gold alloy for engineering purposes |
| JIS C 5946:2005 | General rules of laser diode modules for optical fiber amplifier |
| JIS C 8280:2007 | Edison screw lampholders |
| JIS C 4908:2007 | Capacitors for electrical apparatus |
| JIS Z 3851:1992 | Standard qualification procedure for micro soldering technique |
| JIS C 5260-5:2000 | Potentiometers for use in electronic equipment -- Part 5: Sectional specification: Single-turn rotary low-power wirewound and non-wirewound potentiometers |
| JIS C 5260-2:2000 | Potentiometers for use in electronic equipment -- Part 2: Sectional specification: Lead-screw actuated and rotary preset potentiometers |
| JIS C 5201-1:1998 | Fixed resistors for use in electronic equipment Part 1: Generic specification Part 1: Generic specification |
| JIS C 5260-4:2000 | Potentiometers for use in electronic equipment -- Part 4: Sectional specification: Single-turn rotary power potentiometers |
| JIS C 4526-1:2005 | Switches for appliances -- Part 1: General requirements |
| JIS C 2570-1:2006 | Directly heated negative temperature coefficient thermistors -- Part 1: Generic specification |
| JIS C 4526-2-4:2005 | Switches for appliances -- Part 2-4: Particular requirements for independently mounted switches |
| JIS H 8619:1999 | Electroplated coatings of tin |
| JIS C 61191-1:2006 | Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| JIS C 5260-3:2000 | Potentiometers for use in electronic equipment -- Part 3: Sectional specification: Rotary precision potentiometers |
| JIS C 4610:2005 | Circuit-breakers for equipment |
| JIS C 5953-6:2009 | Fiber optic active components and devices -- Performance standards -- Part 6: 650 nm 250 Mbit/s plastic optical fiber transceivers |
| JIS C 8121-1:2005 | Miscellaneous lampholders -- Part 1: General requirements and tests |
| JIS C 2133:1999 | Flexible insulating sleeving -- Part 2: Methods of test |
| JIS C 60068-2-58:2006 | Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
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