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JIS C 60068-2-20:1996

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Basic environmental testing procedures Part 2: Tests. Test T: Soldering

Available format(s)

Hardcopy , PDF

Superseded date

23-12-2016

Superseded by

JIS C 60068-2-20:2010

Language(s)

English, Japanese

Published date

15-02-2008

€40.52
Excluding VAT

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This Standard is applicable to all electrical and electronic components liable to be submitted to the tests described below.

DocumentType
Standard
Pages
25
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy

JIS C 2570:1998 Directly heated negative temperature coefficient thermistors
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JIS H 8624:1999 Electroplated coatings of Tin-Lead alloys
JIS C 60068-2-54:1996 Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method
JIS B 7102:1995 Small Flash Connections For Cameras
JIS C 5260-1:1999 Potentiometers for use in electronic equipment Part 1: Generic specification
JIS C 4526-2-5:2005 Switches For Appliances - Part 2-5: Particular Requirements For Change-over Selectors
JIS C 6703:2002 Generic specification of crystal filters
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JIS C 6114-1:2006 General Rules Of Optical Modulator Modules
JIS C 4526-2-1:2005 Switches For Appliances - Part 2-1: Particular Requirements For Cord Switches
JIS C 5402:1992 Method for test of connectors for use in electronic equipment
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JIS H 8645:1999 Autocatalytic nickel-phosphorus coatings on metals
JIS C 6115-1:2006 General Rules Of Pin-fet Modules
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JIS C 5402-12-6:2002 Connectors For Electronic Equipment - Tests And Measurements - Part 12-6: Soldering Tests - Test 12f: Sealing Against Flux And Cleaning Solvents In Machine Soldering
JIS C 6691:2003 Thermal-links - Requirements and application guide
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JIS C 8324:2004 Lampholders For Tubular Fluorescent Lamps And Starterholders
JIS C 5402-12-7:2005 Connectors for electronic equipment -- Tests and measurements -- Part 12-7: Soldering tests -- Test 12g: Solderability, wetting balance method
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JIS C 5381-331:2006 Components For Low-voltage Surge Protective Devices - Part 331: Specification For Metal Oxide Varistors (mov)
JIS C 5944:2005 General Rules Of Laser Diode Modules For Fiber Optic Transmission
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JIS C 5444:2000 Testing methods of surface mounting switches for use in electronic equipment
JIS C 6575-2:2005 Miniature fuses Part 2: Cartridge fuse-links
JIS H 8621:1998 Electroplated coatings of silver for engineering purposes
JIS C 6701:2007 Generic specification of quartz crystal units
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JIS C 2809:1999 Flat, Quick-connect Terminations
JIS C 60068-2-21:2002 Environmental testing Part 2-21: Tests - Test U: Robustness of termination and integral mounting devices
JIS E 6202:1993 Electromagnetic Relays For Railway Rolling Stock - General Requirement
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JIS H 8620:1998 Electroplated coatings of gold and gold alloy for engineering purposes
JIS C 5946:2005 General rules of laser diode modules for optical fiber amplifier
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JIS C 4908:2007 Capacitors for electrical apparatus
JIS Z 3851:1992 Standard qualification procedure for micro soldering technique
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JIS C 4526-1:2005 Switches For Appliances - Part 1: General Requirements
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JIS C 4526-2-4:2005 Switches For Appliances - Part 2-4: Particular Requirements For Independently Mounted Switches
JIS H 8619:1999 Electroplated coatings of tin
JIS C 61191-1:2006 Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies
JIS C 5260-3:2000 Potentiometers For Use In Electronic Equipment - Part 3 - Sectional Specification: Rotary Precision Potentiometers
JIS C 4610:2005 Circuit-breakers For Equipment
JIS C 5953-6:2009 Fiber Optic Active Components And Devices - Performance Standards - Part 6: 650 Nm 250 Mbit/s Plastic Optical Fiber Transceivers
JIS C 8121-1:2005 Miscellaneous Lampholders - Part 1: General Requirements And Tests
JIS C 2133:1999 Flexible Insulating Sleeving - Part 2: Methods Of Test
JIS C 60068-2-58:2006 Environmental Testing - Part 2: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)

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