JIS C 60068-2-58:2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
25-03-2006
23-10-2025
Introduction1 Scope2 Normative references3 Definitions4 Pre-conditioning5 Solder bath method 5.1 Test apparatus and materials for the solder bath method6 Procedure for solder bath method 6.1 Number of specimens 6.2 Clamping 6.3 Fluxing 6.4 Solder immersion7 Solder reflow methods 7.1 Test apparatus and materials8 Test procedure of reflow method 8.1 Number of specimens 8.2 Application of solder paste 8.3 Placement of specimens 8.4 Pre-heating 8.5 Solder reflow9 Flux removal 9.1 Recovery 9.2 Evaluation10 Information to be given in the relevant specificationAnnex A (normative) - Criteria for visual examinationAnnex B (informative) - Guidance Annex 1 (informative) - Method of measuring temperature and treatments of moisture soaking and baking for semiconductor SMDsAnnex 2 (informative) - Comparison table between JIS and corresponding international standard
Outlines test Td, applicable to surface mounting devices (SMD). Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD).
| DocumentType |
Standard
|
| PublisherName |
Japanese Standards Association
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| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
2006 [25/03/2006]2002 [20/03/2002]94 [01/02/2000]
| JIS C 60068-2-20:1996 | Basic environmental testing procedures Part 2: Tests. Test T: Soldering Part 2: Tests. Test T: Soldering |
| JIS C 60068-1:1993 | Environmental testing Part 1: General and guidance Part 1: General and guidance |
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| JIS C 0099:2005 | Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste |
| JIS C 6462:1996 | Test methods of variable capacitors for use in electronic equipment |
| JIS C 5444:2000 | Testing methods of surface mounting switches for use in electronic equipment |
| JIS C 2570-2:2008 | Directly heated negative temperature coefficient thermistors -- Part 2: Sectional specification -- Surface mount negative temperature coefficient thermistors |
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| JIS C 5101-21:2006 | Fixed capacitors for use in electronic equipment -- Part 21: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class1 |
| JIS C 5260-5:2000 | Potentiometers for use in electronic equipment -- Part 5: Sectional specification: Single-turn rotary low-power wirewound and non-wirewound potentiometers |
| JIS C 5260-2:2000 | Potentiometers for use in electronic equipment -- Part 2: Sectional specification: Lead-screw actuated and rotary preset potentiometers |
| JIS C 5260-4:2000 | Potentiometers for use in electronic equipment -- Part 4: Sectional specification: Single-turn rotary power potentiometers |
| JIS C 2570-1:2006 | Directly heated negative temperature coefficient thermistors -- Part 1: Generic specification |
| JIS C 60068-2-47:2008 | Environmental testing -- Part 2-47: Tests -- Mounting of specimens for vibration, impact and similar dynamic tests Part 2-47: Tests - Mounting of specimens for vibration, impact and similar dynamic tests |
| JIS C 5260-3:2000 | Potentiometers for use in electronic equipment -- Part 3: Sectional specification: Rotary precision potentiometers |
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