JIS C 60068-2-58:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental Testing - Part 2: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
Hardcopy
07-02-2017
Japanese
25-03-2006
Introduction1 Scope2 Normative references3 Definitions4 Pre-conditioning5 Solder bath method 5.1 Test apparatus and materials for the solder bath method6 Procedure for solder bath method 6.1 Number of specimens 6.2 Clamping 6.3 Fluxing 6.4 Solder immersion7 Solder reflow methods 7.1 Test apparatus and materials8 Test procedure of reflow method 8.1 Number of specimens 8.2 Application of solder paste 8.3 Placement of specimens 8.4 Pre-heating 8.5 Solder reflow9 Flux removal 9.1 Recovery 9.2 Evaluation10 Information to be given in the relevant specificationAnnex A (normative) - Criteria for visual examinationAnnex B (informative) - Guidance Annex 1 (informative) - Method of measuring temperature and treatments of moisture soaking and baking for semiconductor SMDsAnnex 2 (informative) - Comparison table between JIS and corresponding international standard
Outlines test Td, applicable to surface mounting devices (SMD). Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD).
| DocumentType |
Standard
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| Pages |
0
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| PublisherName |
Japanese Standards Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
2006 [25/03/2006]2002 [20/03/2002]94 [01/02/2000]
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