JIS C 60068-2-69:2009
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Available format(s)
PDF
Language(s)
English
Published date
21-12-2009
Publisher
Withdrawn date
23-10-2025
Superseded by
€89.00
Excluding VAT
This Japanese Industrial Standard specifies test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices (SMD).
| DocumentType |
Standard
|
| Pages |
27
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 60068-2-69:2007 | Identical |
Reaffirmed 2014 2009(R2014) [20/10/2014]2009 [21/12/2009]
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