JIS C 61191-1:2006
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published date
25-03-2006
Publisher
Withdrawn date
23-10-2025
Superseded by
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| DocumentType |
Standard
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy |
2006(R2010) [01/10/2010]2006 [25/03/2006]
| JIS Z 3284:1994 | Solder paste |
| JIS Z 3282:2006 | Soft solders -- Chemical compositions and forms |
| TR C 0027-2:2002 | Protection of electronic devices from electrostatic phenomena -- Part 2: User guide |
| JIS C 61191-4:2006 | Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies |
| JIS C 5070:2002 | Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide |
| TR C 0027-1:2002 | Protection of electronic devices from electrostatic phenomena -- Part 1: General requirements |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS Q 9001:2000 | Quality management systems -- Requirements |
| JIS C 60721-3-1:1997 | Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Storage Part 3: Classification of groups of environmental parameters and their severities Storage |
| JIS C 61191-3:2006 | Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies |
| JIS C 61191-2:2006 | Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies |
| JIS C 60068-2-20:1996 | Basic environmental testing procedures Part 2: Tests. Test T: Soldering Part 2: Tests. Test T: Soldering |
| JIS C 61191-3:2006 | Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies |
| JIS C 61191-4:2006 | Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies |
| JIS C 61191-2:2006 | Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies |
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