JIS C 6480:1994
Current
The latest, up-to-date edition.
General rules of copper-clad laminates for printed wiring boards
Hardcopy , PDF
English, Japanese
28-02-1994
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This Japanese Industrial Standard specifies the basic matters for determination of classes, performances, marking, etc. of copper-clad laminates for printed wiring boards, and multilayer printed wiring boards (hereafter referred to as "copper-clad laminates").
| DocumentType |
Standard
|
| Pages |
9
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2015 94(R2015) [20/10/2015]94(R2010) [01/10/2010]94(R2001) [20/09/2001]94 [01/01/1994]8986
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS C 6511:1992 | Test Methods Of Copper Foil For Printed Wiring Boards |
| JIS C 6482:1997 | Copper-clad laminates for printed wiring boards - Paper base, epoxy resin |
| JIS R 3410:2006 | Glossary Of Terms Relating To Textile Glass |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS C 6472:1995 | Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film) |
| JIS C 6485:1997 | Copper-clad laminates for printed wiring boards - Paper base, phenolic resin |
| JIS C 6483:1997 | Copper-clad laminates for printed wiring boards - Synthetic fiber fabric base, epoxy resin |
| JIS C 5014:1994 | Multilayer printed wiring boards |
| JIS C 6486:1996 | Thin copper-clad laminates for multilayer printed wiring boards - Glass fabric base, epoxy resin |
| JIS H 8646:1991 | Electroless copper platings |
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS Z 3284:1994 | Solder paste |
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