JIS H 8624:1999
Current
The latest, up-to-date edition.
Electroplated coatings of Tin-Lead alloys
Hardcopy , PDF
Japanese, English
31-05-2000
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This Japanese Industrial Standard specifies electroplated coatings of tin-lead alloy plated on the significant surface of such basis metal as iron or copper or its alloy for the purpose of improving solderability, electrical characteristics, and corrosion resistance of electrical and electronic appliances.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2013 1999(R2013) [21/10/2013]1999(R2008) [01/10/2008]1999 [20/08/1999]1990 [01/06/1990]
| JIS H 0400:1998 | Glossary of terms used in electroplating and related processes |
| JIS C 60068-2-52:2000 | Environmental testing Part 2: Tests - Test Kb: Salt mist, cyclic (sodium, chloride solution) |
| JIS Z 3910:1990 | Methods for chemical analysis of solder |
| JIS H 8620:1998 | Electroplated coatings of gold and gold alloy for engineering purposes |
| JIS Z 3910:2008 | Methods for chemical analysis of solder |
| JIS Z 9031:2001 | Procedure for random number generation and randomization |
| JIS H 8504:1999 | Methods of adhesion test for metallic coatings |
| JIS K 0119:2008 | General rules for X-ray fluorescence analysis |
| JIS Z 3282:2006 | Soft solders - Chemical compositions and forms |
| JIS C 60068-2-20:1996 | Basic environmental testing procedures Part 2: Tests. Test T: Soldering |
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