JIS Z 3197:1999
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Testing methods for soldering fluxes
Hardcopy , PDF
23-12-2016
Japanese, English
20-03-1999
This Japanese Industrial Standard specifies the testing method for soldering fluxes mainly used for wiring electric equipments, electronic equipments, communication equipments, and parts and components of these equipments.
DocumentType |
Standard
|
Pages |
0
|
PublisherName |
Japanese Standards Association
|
Status |
Superseded
|
SupersededBy |
JIS H 3100:2006 | Copper and copper alloy sheets, plates and strips |
JIS K 2265:1996 | Crude oil and petroleum products - Determination of flash point |
JIS Z 3283:2006 | Resin flux cored solders |
JIS K 5400:1990 | Testing methods for paints |
JIS K 5902:1969 | Colophonium |
JIS Z 3284:1994 | Solder paste |
JIS K 8312:1992 | Potassium Chromate |
JIS K 8858:2007 | Benzene (reagent) |
JIS K 8891:2006 | Methanol |
JIS Z 8803:1991 | Viscosity of liquid - Methods of measurement |
JIS K 9000:1996 | Ammonium Thiocyanate |
JIS K 8252:1992 | Ammonium Peroxydisulfate |
JIS H 3260:2006 | Copper and copper alloy wires |
JIS K 9000:2008 | Ammonium Thiocyanate (reagent) |
JIS K 8723:1995 | Nitrobenzene |
JIS K 8951:2006 | Sulfuric Acid |
JIS R 3703:1998 | Slide glasses for microscope |
JIS K 8034:2006 | Acetone |
JIS K 8101:2006 | Ethanol (99.5) |
JIS K 8150:2006 | Sodium Chloride |
JIS Z 8703:1983 | Standard atmospheric conditions for testing |
JIS B 7502:1994 | Micrometer callipers |
JIS K 8541:2006 | Nitric Acid |
JIS K 8982:1996 | Ammonium Iron (3) Sulfate 12-water |
JIS R 6252:2006 | Abrasive papers |
JIS K 8839:2007 | 2-propanol (reagent) |
JIS K 8322:2006 | Chloroform |
JIS Z 3282:2006 | Soft solders - Chemical compositions and forms |
JIS K 3351:1995 | Glycerines For Industrial Use |
JIS K 8057:1992 | Alizarin Red S |
JIS K 8550:2006 | Silver Nitrate |
JIS B 7525:1997 | Density hydrometers |
JIS K 8982:2008 | Ammonium Iron (3) Sulphate 12-water (reagent) |
JIS K 8180:2006 | Hydrochloric acid |
JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
JIS Z 3198-6:2003 | Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead |
JIS C 0099:2005 | Environmental testing: Tests - Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste |
JIS Z 3198-7:2003 | Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components Part 7: Methods for shear strength of solder joints on chip components |
JIS Z 3283:2006 | Resin flux cored solders |
JIS Z 3284:1994 | Solder paste |
JIS C 61191-1:2006 | Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies |
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