JIS Z 3198-4:2003
Current
Current
The latest, up-to-date edition.
Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method Part 4: Methods for solderbility test by a wetting balance method and a contact angle method
Available format(s)
PDF
Language(s)
English
Published date
20-06-2003
Publisher
€32.63
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This Standard specifies the methods for solderability test of a wetting balance method and a contact angle method of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]
| JIS K 8034:2006 | Acetone |
| JIS K 5902:1969 | Colophonium |
| JIS H 3100:2006 | Copper and copper alloy sheets, plates and strips |
| JIS H 3260:2006 | Copper and copper alloy wires |
| JIS K 8839:2007 | 2-Propanol (Reagent) |
| JIS K 8180:2006 | Hydrochloric acid |
| JIS Z 3282:2006 | Soft solders -- Chemical compositions and forms |
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