JIS Z 3284-3:2024
Current
The latest, up-to-date edition.
Solder paste -- Part 3: Test methods for printability, viscosity, slump and tackiness
English
22-01-2024
This Standard specifies the printability test, viscosity characteristic test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
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