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ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
:
Available format(s): PDF
Withdrawn date: 17-03-2010
Language(s):
Published date:
Publisher: US Military Specs/Standards/Handbooks
1. SCOPE2. APPLICABLE DOCUMENTS3. REQUIREMENTS 4. QUALITY ASSURANCE PROVISIONS5. PACKAGING6. NOTES
Describes a fast curing adhesive used for bonding parts to printed-wiring assemblies to stop vibration damage.
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