MIL-C-14550 Revision B:1983
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
COPPER PLATING (ELECTRODEPOSITED)
07-04-1998
1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PACKAGING
6 NOTES
Describes electrodeposited copper plating on metal surfaces.
Committee |
AREA MFFP
|
DevelopmentNote |
B NOTICE 1 - Notice of Cancellation/Superseded by SAE AMS 2418. (06/2004)
|
DocumentType |
Standard
|
Pages |
15
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
Superseded
|
Standards | Relationship |
SAE AMS 2418 : 2017 | Similar to |
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MIL-HDBK-1250 Revision A:1995 | CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES |
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MIL-H-28719 Base Document:1970 | HEADER, HERMETICALLY SEALED |
MIL-STD-275 Revision E:1984 | PRINTED WIRING - ELECTRONIC EQUIPMENT |
MIL-P-81728 Revision A:1973 | PLATING, TIN LEAD, (ELECTRODEPOSITED) |
MIL-T-48295 Base Document:1974 | TEST SET, ELECTRICAL CIRCUIT, BOMB DISPENSER A/E 24T-79 |
MIL S 12883 : D | SOCKET AND ACCESSORIES FOR PLUG-IN ELECTRONIC COMPONENTS GENERAL SPECIFICATION FOR |
NASA MSFC SPEC 250 : 1963 | PROTECTIVE FINISHES FOR SPACE VEHICLE STRUCTURES AND ASSOCIATED FLIGHT EQUIPMENT GENERAL SPECIFICATION FOR |
MIL F 15733 : G | FILTERS & CAPACITORS, RADIO FREQUENCY INTERFERENCE |
MIL-S-2609 Revision D:1968 | SIGN BOX, INTERIOR ILLUMINATED, ELECTRIC [4 INCH BY 15 INCH MESSAGE] |
MIL-STD-2118 Base Document:1984 | FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR |
NASM24149:2001 | STUDS, WELDING, AND ARC SHIELDS (FERRULES), GENERAL SPECIFICATION FOR |
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MIL C 55302 : E | CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, RECEPTACLE |
MIL-M-83524 Base Document:1985 | MICROSCOPE, OPTICAL, MONOCULAR, HAND-HELD, PORTABLE, MILITARIZED, 200X MAGNIFICATION, FOR FIELD INSPECTION OF OPTICAL FIBERS |
MIL F 14072 : D | FINISHES FOR GROUND BASED ELECTRONIC EQUIPMENT |
MIL-F-14256 Revision F:1993 | FLUX, SOLDERING, LIQUID (ROSIN BASE) |
MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
ASTM E 8 : 2004 | Standard Test Methods for Tension Testing of Metallic Materials |
MIL-STD-105 Revision E:1989 | SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES |
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