MIL-DTL-5757 Revision N:2017
Current
The latest, up-to-date edition.
RELAYS, ELECTROMAGNETIC, GENERAL SPECIFICATION FOR
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the general performance requirements for electrical relays with contact ratings up to and including 10 amperes for use in electronic, communications, and other applications.
| Committee |
FSC 5945
|
| DevelopmentNote |
Supersedes MIL R 5757 (K). Inactive for New Design. (04/2016)
|
| DocumentType |
Standard
|
| Pages |
43
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
| MIL-PRF-39016-14 Revision F:2016 | Relays, Electromagnetic, Established Reliability, 4PDT, Low Level To 2 Amperes (0.150-Inch Terminal Spacing) |
| MIL-DTL-5757-10 Revision M:2016 | RELAYS, ELECTROMAGNETIC, HERMETICALLY SEALED, DPDT, LOW LEVEL TO 2 AMPERES |
| MIL-PRF-39016-45 Revision F:2018 | Relays, Electromagnetic, Established Reliability, DPDT, Low Level to 2 Amperes (Latching) |
| MIL-PRF-39016-8 Revision J:2016 | Relays, Electromagnetic, Established Reliability, SPDT, Low Level to 0.5 Ampere (Latching) |
| MIL-PRF-39016-12 Revision H:2016 | RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 1.0 AMPERE (LATCHING) |
| MIL-PRF-39016-17 Revision J:2017 | RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 1 AMPERE TERMINALS 0.100-INCH GRID PATTERN |
| MIL-STD-202-212 Base Document:2015 | Method 212, Acceleration |
| MIL-STD-202-211 Base Document:2015 | METHOD 211, TERMINAL STRENGTH |
| MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-DTL-45204 Revision D:2007 | Gold Plating, Electrodeposited |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-202-303 Base Document:2015 | Method 303, DC Resistance |
| SAE AMS QQ N 290 : 2015 | NICKEL PLATING (ELECTRODEPOSITED) |
| MIL-STD-202-101 Base Document:2015 | Method 101, Salt Atmosphere (Corrosion) |
| MIL-STD-202-311 Base Document:2015 | Method 311, Life, Low Level Switching |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
| IEEE 315 : 1975 | GRAPHIC SYMBOLS FOR ELECTRICAL AND ELECTRONICS DIAGRAMS (INCLUDING REFERENCE DESIGNATION LETTERS) |
| MIL-STD-202-215 Base Document:2015 | METHOD 215, RESISTANCE TO SOLVENTS |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-STD-202-214 Base Document:2015 | Method 214, Random Vibration |
| MIL-STD-202-312 Base Document:2015 | Method 312, Life, Intermediate Current Switching |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-112 Base Document:2015 | METHOD 112, SEAL |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
| MIL-STD-202-307 Base Document:2015 | Method 307, Contact Resistance |
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