• Shopping Cart
    There are no items in your cart

MIL-PRF-31032-5 Revision C:2020

Current

Current

The latest, up-to-date edition.

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications

Available format(s)

PDF

Language(s)

English

Published date

05-05-2020

€17.95
Excluding VAT

DocumentType
Standard
Pages
56
PublisherName
US Military Specs/Standards/Handbooks
Status
Current
Supersedes

This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic, thermosetting, or thermoplastic and thermosetting base materials, that will use soldering for component/part mounting (see 6.1.1). Mixed base material printed boards containing both thermoplastic and thermosetting resin base materials are also covered. The printed board may contain an internal metal core or external heat sink.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.