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  • MIL-PRF-31032-5 Revision B:2017

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS

    Available format(s):  PDF

    Superseded date:  05-05-2020

    Language(s):  English

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

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    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    2. APPLICABLE DOCUMENTS
    3. REQUIREMENTS
    4. VERIFICATION
    5. PACKAGING
    6. NOTES

    Abstract - (Show below) - (Hide below)

    Specifies the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting.

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    Committee FSC 5998
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 2252 : 0 DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    ASTM E 345 : 2016 : REDLINE Standard Test Methods of Tension Testing of Metallic Foil
    IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
    ASTM E 595 : 2015 : REDLINE Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
    IPC 2141 : A DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
    IPC TM 650 : 0 TEST METHODS MANUAL
    MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
    IPC 2251 : 0 DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
    ASTM B 567 : 1998 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    MIL-STD-202-105 Base Document:2015 METHOD 105, BAROMETRIC PRESSURE (REDUCED)
    IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
    MIL-STD-202-214 Base Document:2015 METHOD 214, RANDOM VIBRATION
    MIL-STD-202-204 Base Document:2015 METHOD 204, VIBRATION, HIGH FREQUENCY
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