MIL-PRF-31032-5 Revision C:2020
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The latest, up-to-date edition.
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications
English
05-05-2020
This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic, thermosetting, or thermoplastic and thermosetting base materials, that will use soldering for component/part mounting (see 6.1.1). Mixed base material printed boards containing both thermoplastic and thermosetting resin base materials are also covered. The printed board may contain an internal metal core or external heat sink.
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