MIL-PRF-31032-6 Revision B:2017
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
English
06-10-2017
06-05-2020
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Describes the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting.
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
This specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic or thermosetting base materials, that will use soldering for component/part mounting (see 6.1). The printed board may contain an external heat sink.
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| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| ASTM B 567 : 1998 | Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method |
| MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
| MIL-STD-202-214 Base Document:2015 | Method 214, Random Vibration |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
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