MIL-PRF-32192 Base Document:2005
Current
The latest, up-to-date edition.
Resistor, Chip, Thermal (Thermistor), General Specification for
29-07-2005
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION INSPECTION
Describes the requirements for fixed, chip, thermal resistors.
| DocumentType |
Standard
|
| Pages |
136
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
This specification covers the general requirements for fixed, chip, thermal resistors. These thermistors exhibit a positive temperature coefficient (PTC) or a negative temperature coefficient (NTC) and are primarily intended for incorporation into surface mount applications. These devices are to be used for temperature control, temperature compensation, sensing, and frequency compensation over the temperature range specified.
| MIL-PRF-32192-1 Base Document:2005 | Resistor, Chip, Thermal (Thermistor), Positive Temperature Coefficient, Style RCTP0303 |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| DSCC 93074 : C | THERMISTOR, (THERMALLY SENSITIVE RESISTOR), NTC, CHIP, STYLE 1206 |
| MIL-HDBK-199 Revision D:2018 | Resistors, Selection and Use of |
| MIL-DTL-39032 Revision E:2000 | Resistors, Packaging of |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| DSCC 03017 : B | RESISTOR, THERMAL, THERMISTOR, DIE CHIP, POSITIVE TEMPERATURE COEFFICIENT (PTC) STYLE 0303 |
| DSCC 03018 : B | RESISTOR, THERMAL, THERMISTOR, DIE CHIP, NEGATIVE TEMPERATURE COEFFICIENT (NTC), STYLE 0404 |
| DSCC 93073 : E | RESISTOR, THERMAL, CHIP, NTC, STYLE 0805 |
| MIL-PRF-32192-5 Base Document:2005 | Resistor, Chip, Thermal (Thermistor), Insulated Negative Temperature Coefficient Style RCTN1206 |
| DSCC 98018 : E | RESISTOR, CHIP, THERMAL (THERMISTOR), PTC, STYLE 0805 |
| MIL-PRF-32192-5 Base Document:2005 | Resistor, Chip, Thermal (Thermistor), Insulated Negative Temperature Coefficient Style RCTN1206 |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| MIL-STD-202-107 Base Document : 2015 | Method 107, Thermal Shock |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-STD-202-215 Base Document:2015 | Method 215, Resistance to Solvents |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| MIL-STD-202-104 Base Document:2015 | Method 104, Immersion |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| MIL-PRF-32192-1 Base Document:2005 | Resistor, Chip, Thermal (Thermistor), Positive Temperature Coefficient, Style RCTP0303 |
| MIL-STD-1285 Revision D:2004 | Marking of Electrical and Electronic Parts |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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