MIL-PRF-32192 Base Document:2005
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RESISTOR, CHIP, THERMAL (THERMISTOR), GENERAL SPECIFICATION FOR
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION INSPECTION
Describes the requirements for fixed, chip, thermal resistors.
| Committee |
FSC 5905
|
| DocumentType |
Standard
|
| Pages |
136
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
| MIL-PRF-32192-1 Base Document:2005 | RESISTOR, CHIP, THERMAL (THERMISTOR), POSITIVE TEMPERATURE COEFFICIENT, STYLE RCTP0303 |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| DSCC 93074 : C | THERMISTOR, (THERMALLY SENSITIVE RESISTOR), NTC, CHIP, STYLE 1206 |
| MIL-HDBK-199 Revision D:2018 | Resistors, Selection and Use of |
| MIL-DTL-39032 Revision E:2000 | RESISTORS, PACKAGING OF |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| DSCC 03017 : B | RESISTOR, THERMAL, THERMISTOR, DIE CHIP, POSITIVE TEMPERATURE COEFFICIENT (PTC) STYLE 0303 |
| DSCC 03018 : B | RESISTOR, THERMAL, THERMISTOR, DIE CHIP, NEGATIVE TEMPERATURE COEFFICIENT (NTC), STYLE 0404 |
| DSCC 93073 : E | RESISTOR, THERMAL, CHIP, NTC, STYLE 0805 |
| MIL-PRF-32192-5 Base Document:2005 | RESISTOR, CHIP, THERMAL (THERMISTOR), INSULATED NEGATIVE TEMPERATURE COEFFICIENT STYLE RCTN1206 |
| DSCC 98018 : E | RESISTOR, CHIP, THERMAL (THERMISTOR), PTC, STYLE 0805 |
| MIL-PRF-32192-5 Base Document:2005 | RESISTOR, CHIP, THERMAL (THERMISTOR), INSULATED NEGATIVE TEMPERATURE COEFFICIENT STYLE RCTN1206 |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-STD-202-215 Base Document:2015 | METHOD 215, RESISTANCE TO SOLVENTS |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| MIL-STD-202-104 Base Document:2015 | Method 104, Immersion |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-PRF-32192-1 Base Document:2005 | RESISTOR, CHIP, THERMAL (THERMISTOR), POSITIVE TEMPERATURE COEFFICIENT, STYLE RCTP0303 |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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