MIL-PRF-32560 Base Document:2016
NA
Status of Standard is Unknown
COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION INSPECTION
APPENDIX B - ALTERNATE INDUCTANCE & QUALITY FACTOR (Q) &
SELF-RESONANT FREQUENCY (SRF) MEASUREMENT PROCEDURES
Specifies the general requirements for established reliability (ER) fixed, radio frequency surface mount coils.
| Committee |
FSC 5950
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| DevelopmentNote |
NEW CHILD NOT 1 2021 IS NOW ADDED.
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| DocumentType |
Standard
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| Pages |
34
|
| ProductNote |
NEW CHILD NOT 1 2021 IS NOW ADDED.
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| PublisherName |
US Military Specs/Standards/Handbooks
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| Status |
NA
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| MIL-PRF-32560-5 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED, ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-PRF-32560-4 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, UNSHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-PRF-32560-2 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-PRF-32560-1 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, CONFORMAL COATED, ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-PRF-32560-6 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, OPEN CONSTRUCTION ESTABLISHED RELIABILITY, SURFACE MOUNT, 0603 SIZE |
| MIL-PRF-32560-3 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, UNSHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-202-303 Base Document:2015 | Method 303, DC Resistance |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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