MIL-PRF-55681 Revision G:2016
Current
Current
The latest, up-to-date edition.
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - EQUIVALENT SERIES RESISTANCE MEASUREMENT CRITERIA
FOR HIGH FREQUENCY CAPACITOR STYLES CDR11 THROUGH CDR14
AND CDR21 THROUGH CDR25
APPENDIX B - PROCEDURE FOR QUALIFICATION INSPECTION
APPENDIX C - VISUAL INSPECTION CRITERIA
Specifies the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors.
| Committee |
FSC 5910
|
| DevelopmentNote |
Supersedes MIL C 55681 (D) (07/2001)
|
| DocumentType |
Standard
|
| Pages |
91
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
| 18/30373170 DC : 0 | BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
| MIL-PRF-55681-4 Revision H:2015 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY) |
| DSCC 09027 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210 |
| DSCC 05007 : F | CAPACITORS, FIXED, CERAMIC, CHIP, 1206 |
| MIL-PRF-83531 Revision D:2014 | DELAY LINES, PASSIVE, GENERAL SPECIFICATION FOR |
| DSCC 91019 : K | CAPACITOR, FIXED, CERAMIC, CHIP, .56 [MU]F THROUGH 1 [MU]F |
| DSCC 14005 : 0 | CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0508 |
| DSCC 09023 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201 |
| DSCC 88013 : G | DELAY LINES, PASSIVE, 3-PIN, SIP |
| DSCC 06019 : B | CAPACITOR, FIXED, CERAMIC, CHIP, HIGH FREQUENCY |
| DSCC 05006 : F | CAPACITORS, FIXED, CERAMIC, CHIP, 0805 |
| DSCC 03029 : E | CAPACITOR, FIXED, CERAMIC, CHIP, 0402 |
| DSCC 94006 : D | CAPACITORS, FIXED, CERAMIC, CHIP |
| DSCC 05002 : G | CAPACITOR, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP |
| DSCC 05003 : E | CAPACITOR, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP |
| DSCC 09026 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805 |
| DSCC 05001 : F | CAPACITOR, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| DSCC 89089 : C | CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE |
| DSCC 09025 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603 |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| DSCC 84035 : D | DELAY LINES, PASSIVE, 10-TAP, DUAL-IN-LINE, 16-PIN |
| DSCC 09024 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402 |
| DSCC 06022 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY |
| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
| MIL-HDBK-198 Revision B:2012 | CAPACITORS, SELECTION AND USE OF |
| DSCC 03028 : E | CAPACITORS, FIXED, CERAMIC, CHIP, 0603 |
| DSCC 14004 : 0 | CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0306 |
| MIL-STD-202-211 Base Document:2015 | METHOD 211, TERMINAL STRENGTH |
| MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-202-305 Base Document:2015 | Method 305, Capacitance |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| MIL-STD-202-104 Base Document:2015 | Method 104, Immersion |
| MIL-STD-202-103 Base Document:2015 | Method 103, Humidity (Steady State) |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
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