MIL S 19491 : G
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SEMICONDUCTOR DEVICE, PACKAGING OF
28-06-2002
Important note : Users cannot be edited or removed once added to your Multi user PDF.Details requirements for the preservation, packing and container marking of all types of semiconductor devices (e.g., junction field effect transistors, microwave diodes and light emitting diode fiber optic sources) in FSC's 5961 and 6030 and associated accessories in FSC 5999. Coverage includes applicable documents, hardware, physical protection, cleaning, drying, preservatives, and semiconductor devices.
| Committee |
AREA PACK
|
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
| MIL-M-38527 Revision D:1992 | MOUNTING PADS, ELECTRICAL-ELECTRONIC COMPONENT, GENERAL SPECIFICATION FOR |
| MIL D 83531 : A (3) | DELAY LINES, PASSIVE |
| MIL-E-17555 Revision H:1984 | ELECTRONIC AND ELECTRICAL EQUIPMENT, ACCESSORIES, AND PROVISIONED ITEMS (REPAIR PARTS); PACKAGING OF |
| MIL-P-9024 Revision G:1972 | PACKAGING, MATERIALS HANDLING AND TRANSPORTABILITY, SYSTEM AND SYSTEM SEGMENTS GENERAL SPECIFICATION FOR |
| MIL-STD-726 Revision H:1985 | PACKAGING REQUIREMENTS CODE |
| MIL-H-87111 Revision A:1984 | HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL S 19500 : J | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| DOD-D-24620-1 Base Document:1984 | DETECTOR, PIN, FIBER OPTIC 820-910 NANOMETERS WAVELENGTH RANGE GLASS PIGTAILED TYPE |
| MIL-S-19500-202 Revision A:1962 | SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER RECTIFIERS, TYPES JAN 1N538M JAN 1N540M AND JAN 1N547M |
| PPP-C-1752 Revision D:1989 | CUSHIONING MATERIAL, PACKAGING, POLYETHYLENE FOAM |
| MIL-B-117G:1993 | BAG, SLEEVE AND TUBING |
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| MIL-M-38527 Revision D:1992 | MOUNTING PADS, ELECTRICAL-ELECTRONIC COMPONENT, GENERAL SPECIFICATION FOR |
| ASTM D 3953 : 2015 : REDLINE | Standard Specification for Strapping, Flat Steel and Seals |
| MIL-H-87111 Revision A:1984 | HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL B 81705 : C | BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE |
| MIL-STD-2073-1 Revision E:2008 | STANDARD PRACTICE FOR MILITARY PACKAGING |
| MIL-STD-1686 Revision C:1995 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) |
| MIL-STD-45662 Revision A:1988 | CALIBRATION SYSTEMS REQUIREMENTS |
| DOD S 24622 : 1984 | SOURCES, LED, FIBER OPTIC, GENERAL SPECIFICATION FOR (METRIC) |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| PPP-C-1797 Revision A:1982 | CUSHIONING MATERIAL, RESILIENT, LOW DENSITY, UNICELLULAR POLYPROPYLENE FOAM |
| PPP-C-795 Revision D:1994 | Cushioning Material, Closed Cell Flexible, Plastic Film |
| FED-STD-123 Revision H:2007 | MARKING FOR SHIPMENT (CIVIL AGENCIES) |
| MIL-HDBK-263 Revision B:1994 | ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT |
| MIL S 19500 : J | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL-P-116 Revision J:1988 | PRESERVATION, METHODS OF |
| DOD D 24620 : 1984 | DETECTORS, PIN, FIBER OPTIC (METRIC) |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| PPP-C-1842 Revision B:1992 | CUSHIONING MATERIAL, PLASTIC, OPEN CELL (FOR PACKAGING APPLICATIONS) |
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