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  • MIL S 19491 : G

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SEMICONDUCTOR DEVICE, PACKAGING OF

    Available format(s):  PDF

    Superseded date:  28-06-2002

    Language(s): 

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

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    Abstract - (Show below) - (Hide below)

    Details requirements for the preservation, packing and container marking of all types of semiconductor devices (e.g., junction field effect transistors, microwave diodes and light emitting diode fiber optic sources) in FSC's 5961 and 6030 and associated accessories in FSC 5999. Coverage includes applicable documents, hardware, physical protection, cleaning, drying, preservatives, and semiconductor devices.

    General Product Information - (Show below) - (Hide below)

    Committee AREA PACK
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-M-38527 Revision D:1992 MOUNTING PADS, ELECTRICAL-ELECTRONIC COMPONENT, GENERAL SPECIFICATION FOR
    MIL D 83531 : A (3) DELAY LINES, PASSIVE
    MIL-E-17555 Revision H:1984 ELECTRONIC AND ELECTRICAL EQUIPMENT, ACCESSORIES, AND PROVISIONED ITEMS (REPAIR PARTS); PACKAGING OF
    MIL-P-9024 Revision G:1972 PACKAGING, MATERIALS HANDLING AND TRANSPORTABILITY, SYSTEM AND SYSTEM SEGMENTS GENERAL SPECIFICATION FOR
    MIL-STD-726 Revision H:1985 PACKAGING REQUIREMENTS CODE
    MIL-H-87111 Revision A:1984 HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    MIL S 19500 : J SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    DOD-D-24620-1 Base Document:1984 DETECTOR, PIN, FIBER OPTIC 820-910 NANOMETERS WAVELENGTH RANGE GLASS PIGTAILED TYPE
    MIL-S-19500-202 Revision A:1962 SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER RECTIFIERS, TYPES JAN 1N538M JAN 1N540M AND JAN 1N547M

    Standards Referencing This Book - (Show below) - (Hide below)

    PPP-C-1752 Revision D:1989 CUSHIONING MATERIAL, PACKAGING, POLYETHYLENE FOAM
    MIL-B-117G:1993 BAG, SLEEVE AND TUBING
    MIL-STD-129 Revision R:2014 Military Marking for Shipment and Storage
    MIL-M-38527 Revision D:1992 MOUNTING PADS, ELECTRICAL-ELECTRONIC COMPONENT, GENERAL SPECIFICATION FOR
    ASTM D 3953 : 2015 : REDLINE Standard Specification for Strapping, Flat Steel and Seals
    MIL-H-87111 Revision A:1984 HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    MIL B 81705 : C BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE
    MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
    MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
    MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
    DOD S 24622 : 1984 SOURCES, LED, FIBER OPTIC, GENERAL SPECIFICATION FOR (METRIC)
    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    PPP-C-1797 Revision A:1982 CUSHIONING MATERIAL, RESILIENT, LOW DENSITY, UNICELLULAR POLYPROPYLENE FOAM
    PPP-C-795 Revision D:1994 Cushioning Material, Closed Cell Flexible, Plastic Film
    FED-STD-123 Revision H:2007 MARKING FOR SHIPMENT (CIVIL AGENCIES)
    MIL-HDBK-263 Revision B:1994 ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT
    MIL S 19500 : J SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    MIL-P-116 Revision J:1988 PRESERVATION, METHODS OF
    DOD D 24620 : 1984 DETECTORS, PIN, FIBER OPTIC (METRIC)
    MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
    PPP-C-1842 Revision B:1992 CUSHIONING MATERIAL, PLASTIC, OPEN CELL (FOR PACKAGING APPLICATIONS)
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