MIL-STD-1580 Revision B:2003
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
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Superseded date
26-06-2020
Superseded by
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES
Defines the general requirements for performance of destructive physical analysis (DPA) on samples of parts. In addition to the requirements for the analysis procedures, the general criteria for interpreting results, such as for the acceptance or rejection of associated production lots, is included for typical electronic, electromagnetic, and electromechanical parts.
| Committee |
FSC 59GP
|
| DocumentType |
Standard
|
| Pages |
122
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
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| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| MIL-STD-981 Revision C:2010 | DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS |
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| 17/30318744 DC : 0 | BS ISO 20188 - SPACE SYSTEMS - PRODUCT ASSURANCE REQUIREMENTS FOR COMMERCIAL SATELLITES |
| SAE ARP 6328 : 2016 | GUIDELINE FOR DEVELOPMENT OF COUNTERFEIT ELECTRONIC PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION SYSTEMS |
| ISO 20188:2018 | Space systems — Product assurance requirements for commercial satellites |
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| PD IEC/TS 62647-2:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| SAE AS 6294/1 : 2017 | REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS |
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| MIL-PRF-83401 Revision H:2006 | RESISTOR NETWORKS, FIXED, FILM AND CAPACITOR-RESISTOR NETWORKS, CERAMIC CAPACITOR AND FIXED, FILM, RESISTORS, GENERAL SPECIFICATION FOR |
| MIL-PRF-55342 Revision H:2003 | RESISTOR, CHIP, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
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| MIL-PRF-3098 Revision L:2017 | CRYSTAL UNITS, QUARTZ, GENERAL SPECIFICATION FOR |
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| MIL-PRF-39006 Revision G:2006 | CAPACITOR, FIXED, ELECTROLYTIC (NONSOLID ELECTROLYTE), TANTALUM, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-39007 Revision J:2005 | Resistor, Fixed, Wirewound, (Power Type) Nonestablished Reliability, Established Reliability, and Space Level General Specification for |
| MIL-DTL-81381 Revision C:2005 | WIRE, ELECTRIC, POLYIMIDE-INSULATED, COPPER OR COPPER ALLOY |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
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| MIL-PRF-39009 Revision E:2004 | RESISTOR, FIXED, WIREWOUND, (POWER TYPE, CHASSIS MOUNTED), NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
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| MIL-DTL-38999 Revision M:2015 | Connectors, Electrical, Circular, Miniature, High Density, Quick Disconnect (Bayonet, Threaded or Breech Coupling), Environment Resistant with Crimp Removable Contacts or Hermetically Sealed with Fixed, Solderable Contacts, General Specification for |
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| MIL-PRF-39001 Revision E:2009 | Capacitor, Fixed, MICA Dielectric, Established Reliability and Nonestablished Reliability, General Specification for |
| MIL-PRF-24236 Revision D:2006 | SWITCHES, THERMOSTATIC, (METALLIC AND BIMETALLIC), GENERAL SPECIFICATION FOR |
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| SAE AMS 2644 : 2013 | INSPECTION MATERIAL, PENETRANT |
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| MIL-PRF-39003 Revision N:2016 | Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for |
| MIL-PRF-23648 Revision F:2005 | Resistor, Thermal (Thermistor) Insulated, General Specification for |
| SAE AS 81044 : 2011 | WIRE, ELECTRICAL, CROSSLINKED POLYALKENE, CROSSLINKED ALKANE-IMIDE POLYMER, OR POLYARLYENE INSULATED, COPPER OR COPPER ALLOY |
| MIL-PRF-15305 Revision F:2013 | COILS, ELECTRICAL, FIXED AND VARIABLE, RADIO FREQUENCY, GENERAL SPECIFICATION FOR |
| MIL-PRF-39016 Revision H:2017 | Relays, Electromagnetic, Established Reliability, General Specification for |
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| MIL-PRF-6106 Revision P:2014 | Relays, Electromagnetic General Specification for |
| MIL-PRF-19978 Revision L:2016 | Capacitor, Fixed, Plastic (or Paper-Plastic) Dielectric (Hermetically Sealed in Metal, Ceramic or Glass Cases), Established and Non-Established Reliability, General Specification for |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-PRF-39010 Revision E:1997 | Coil, Radio Frequency, Fixed, Molded, Established Reliability and Nonestablished Reliability, General Specification for |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-PRF-21038 Revision F:2004 | TRANSFORMERS, PULSE, LOW POWER GENERAL SPECIFICATION FOR |
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| MIL-PRF-39015 Revision E:2006 | RESISTOR, VARIABLE, WIREWOUND, (LEAD SCREW ACTUATED), NONESTABLISHED RELIABILITY, AND ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
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